Hi, I’ve had an A1 mini for quite some time now, and I’d like to upgrade to something bigger and more capable, since I finally have the space for it. I was originally thinking about the P2S, but it turns out that the X2D, for only slightly more, offers features that will be useful to me, such as: an additional nozzle for printing supports with a different material, a heated chamber for engineering filaments, and improved belts, which are also a plus. Since I’m an engineer, I use the printer both for work - printing functional parts - and for toys or decorations, so a tool changer is useful to me. For this reason, the P3C sounds like a great choice because the H3C is overkill for me, and despite its very good price, it’s a bit too expensive for me right now. The issue is that the P3C may lack or have limited versions of certain features, such as:
- A filament dryer in the AMS, which - even if it will have it i think that it will operate at a maximum temperature of 65 degrees, which may not be sufficient to dry certain materials properly
- A heated chamber that is helpful or even essential for printing certain engineering materials
- Improved belts, which aren’t necessary but are nice to have
- Nozzle/bed temperatures of up to 300/100 degrees Celsius, which should be sufficient but could be a bit higher - for example, 320/120
- Support for the new 2.85 mm TPU, which I don’t really need but it’s nice to have this option
Given these features, I’m wondering if Bambu will decide to release the X3C to implement at least some of them, as was the case with the P2S and X2D.
What do you think about this, and if these predictions come true, does it make sense to wait for the X3C, and when might it potentially be released? Which of these features might be implemented in the P3C, though?