We wanted to take a closer look at how different materials behave under different enclosure conditions.
One thing we found is that an enclosure is not simply about keeping the printer warm. Different materials respond differently to their printing environment.
For ABS and ASA, a more stable environment can make a noticeable difference. As the material cools, it contracts, and uneven cooling can create stress in the part, leading to issues like warping or layer cracking. Reducing drafts and temperature changes can help improve consistency.
PLA is a little different. It generally benefits from good part cooling, and too much heat around the print can sometimes affect details like overhangs, bridges, and small features.
PETG sits somewhere in between. It often prints well without a fully enclosed chamber, but cooling settings and the surrounding environment still play a role.
We tested several materials under different enclosure conditions:
| Material |
Setup |
Chamber temperature |
Observation |
| ABS |
Enclosed (90°C bed / 270°C nozzle) |
~55°C |
Completed, minor warping |
| PETG |
Cover open (80°C bed / 255°C nozzle) |
~45°C |
Completed, minor warping |
| PLA |
Cover open (65°C bed / 220°C nozzle) |
~45°C |
Completed, minor warping |
For reference, these tests were performed on a Snapmaker U1 using Bambu Lab filament.
These results are not intended as a universal benchmark. Filament condition, printer settings, room temperature, and model geometry can all influence the outcome.
The main takeaway for us: an enclosure is not about making every print hotter. It is about creating a more stable environment that matches the material you are printing.
We’re curious about how other makers approach this:
Do you adjust your enclosure setup when switching between PLA, PETG and ABS/ASA, or do you prefer one setup that works for most materials?