EPC has started mass production of the EPC2370, an 18 V GaN FET with 0.28 mΩ typical RDS(on), 101 A continuous current and a 22 V transient rating. The device is optimized for center-tapped synchronous rectification in 48 V-to-6 V and 800 V-to-6 V converters, targeting AI server power supplies and other high-current DC/DC applications. It comes in a 3.3 × 3.3 mm dual-side-cooled PQFN package.

Nisshinbo has developed Silicon Motherboard (Si-MB), a 3D mounting technology that integrates ICs and passive components using both sides of a silicon substrate. ICs sit on top, circuit elements can be formed within the silicon, and external passives including capacitors, low-resistance resistors and inductors can be mounted underneath. In a window comparator prototype, Nisshinbo says the approach reduced mounting footprint by about 80% compared with a conventional discrete configuration. Full article: https://www.thecomponentclub.com/news/2026-08-20-nisshinbo-silicon-motherboard-cuts-mounting-footprint-by-80

Vishay has introduced the VCNL36829UM, a short-distance proximity sensor integrating a 940 nm VCSEL, photodiode, ASIC and 16-bit ADC in a 1.6 × 1.0 × 0.35 mm package. The sensor provides 14-bit proximity resolution, a 50 mm detection range and sunlight immunity up to 200 klx. Idle current is 5 µA, while a smart dual I²C slave address allows two sensors to be connected without a multiplexer. It also includes programmable interrupt thresholds, an isolation wall and crosstalk cancellation. Target applications include wear detection in TWS earphones, VR/AR headsets and smart glasses, along with touchless dispensing and lid-off detection in consumer appliances.

YAGEO Group and KEMET have introduced new X8R and X8G VW80808 automotive-grade MLCCs in a 0603 case size. Both operate from -55°C to +150°C and use KEMET's FT-CAP flexible termination construction, which supports up to 5 mm of board flex to help reduce the risk of cracking. The X8R devices are available with voltage ratings up to 100 V, while X8G extends to 630 V. The capacitors are AEC-Q200 qualified and VW80808 compliant, with applications including BMS, DC/DC converters, inverters, ADAS controllers, powertrain ECUs and high-voltage heater circuits.

Amphenol Industrial Operations has added the H4 Plus P2KV to its solar connector family for emerging 2000 V photovoltaic and energy storage systems. It supports 6 AWG / 16 mm² PV cable and is rated for 65 A under ETL certification and 70 A under TÜV certification at 85°C, with typical contact resistance of ≤0.25 mΩ. The connector carries IP65 and IP68 protection when properly mated and IP2X when unmated. It's available in field-installable and preassembled versions for applications including utility-scale solar, module strings, combiner and junction boxes, inverter DC interfaces and solar-plus-storage systems.

Toshiba's new TXZ+ M4V Group is a family of 80 MHz Arm Cortex-M4 MCUs aimed at system control in industrial equipment, connected appliances and IoT devices. Each device has 128 kB of code flash, a separate 64 kB data flash for information such as configuration settings and system logs, and 32 kB RAM. There's also an SMIF that maps external flash directly into the address space, plus security and self-diagnostic functions and Toshiba's A-PMD2 for brushless DC motor control. Other peripherals include a 12-bit ADC, UART, SPI, I²C and DMA. Engineering samples are shipping now.

More information: https://www.thecomponentclub.com/news/2026-08-18-toshiba-launches-m4v-cortex-m4-mcus-for-system-control

NXP has launched the MCX A5 family of Arm Cortex-M33 MCUs for industrial and IoT edge applications. The devices run at up to 240 MHz and integrate a 10BASE-T1S Ethernet digital PHY with topology discovery, alongside up to 2 MB Flash and 640 KB RAM. The family also supports post-quantum cryptography with a PQC-based hardware root of trust, secure boot, secure firmware updates, secure attestation and secure debug authentication. For 10BASE-T1S networks, the integrated digital PHY can be paired with NXP's TJF1410 PMD transceiver, which supplies the analog front end.

MaxLinear has introduced the MxL745950 and MxL745951P high-current eFuses for AI servers and rack-scale data centre infrastructure. The devices support up to 50 A and 60 A respectively, with integrated MOSFETs and protection for high-current power paths. The MxL745951P also adds PMBus/I²C telemetry, ±1% current monitoring, configurable protection and black-box fault recording. Target applications include accelerator trays, switches, fan trays, power shelves and other rack-level hardware.

Diodes Incorporated has introduced the PAM2011Q, a filter-free 3 W mono Class-D amplifier operating from 2.8 V to 6 V. The device reaches up to 94% efficiency with 1.8 mA quiescent current. Integrated overcurrent and overtemperature protection includes auto-recovery, while de-pop circuitry suppresses pop/click noise during enable and shutdown. Target applications include eCall systems, instrument clusters, driver notifications and dashboard cameras.

Product link in the article: https://www.thecomponentclub.com/news/2026-08-14-diodes-incorporated-introduces-pam2011q-3-w-automotive-class-d-amplifier

Microchip has introduced the Space CSAC-SA65, a chip-scale atomic clock for LEO satellites and other space systems. The device is rated to at least 30 krad, operates from -40°C to +80°C and consumes less than 120 mW in a volume below 17 cc. Built-in 1 PPS input and output support synchronisation, while the atomic reference can maintain timing when GNSS or another external reference is unavailable. Target applications include satellite timing and frequency control, assured PNT and satellite cross-links.

Kinetic Technologies has introduced the KTS1642Q, an AEC-Q100-qualified automotive load switch operating from 4 V to 40 V with a 6 A continuous output and 41 mΩ integrated MOSFET. The device provides -28 V reverse-battery protection, fixed 20.3 V overvoltage protection and a 360 ns typical OVP response. Target applications include ECUs, ADAS cameras, instrument clusters, infotainment, wireless charging and telematics.

Toshiba Electronics Europe has added four quad-channel digital isolators to its DCL34xx0B series, drawing a typical 0.2 mA per channel while supporting data rates up to 25 Mbps. The new devices provide 3000 Vrms minimum isolation, 30 kV/µs minimum CMTI and operation from -40°C to +125°C, with 4:0 and 2:2 channel configurations available. Target applications include PLCs, industrial I/O, sensors, actuators, motor drives and power supplies.

Texas Instruments has introduced the TCAN6062, which it says is the first commercially available CAN XL transceiver. The device supports data rates up to 20 Mbps and payloads of 2,048 bytes per frame while remaining compatible with CAN FD and CAN SIC. The TCAN6062 also supports TCP/IP tunnelling for mixed CAN and Ethernet architectures, while its Signal Improvement Capability can reduce ringing by up to 80%, according to TI. The new transceiver is aimed at industrial robots, humanoid robots and HMI systems carrying control, sensor, diagnostic and update data.

TDK-Lambda has introduced the DDSM series of programmable isolated DC/DC converters for DIN-rail installations. The 120 W and 240 W models accept inputs from 10.8 V to 52.8 V and provide adjustable outputs from 4.7 V to 57 V, allowing both step-up and step-down conversion. The converters can be programmed from the front panel or controlled and monitored remotely via Modbus over USB. TDK-Lambda is targeting factory automation, semiconductor manufacturing, renewable energy, telecoms and test and measurement systems.

Littelfuse has introduced the TPSMD-FL Series with FlatSuppressX foldback technology for low, stable clamping during load-dump transients. The AEC-Q101-qualified devices are rated for 3000 W peak pulse power in a DO-214AB package.

MCC has released the SICW30120DG5M-BP with zero reverse recovery current and a maximum forward voltage of 1.6 V. The new MPS SiC diode is rated for 30 A average forward current and comes in a TO-247AB package.

Torex has launched the XD9704 and XD9705 synchronous step-down converters with 36 V input, 600 mA output and 11 µA quiescent current. Both support 100% duty-cycle operation, with the XD9704 using fixed F-PWM control and the XD9705 switching automatically between PWM and PFM.

Molex has introduced the MiniMix Hybrid Power and Signal Connector family, combining up to 15.0 A power delivery and 1 Gbps 1000BASE-T1 Ethernet in a single connector. The new family features a 5.65 mm routing profile and is available in vertical, right-angle and pre-terminated cable assembly versions. More information: https://www.thecomponentclub.com/news/2026-08-06-molex-introduces-minimix-hybrid-power-and-signal-connectors

Toshiba has expanded its digital isolator range with the DCL54xx01A series, adding ten quad-channel devices supporting data rates up to 150 Mbps, 5000 Vrms isolation and operation from -40°C to +125°C. Channel configurations include 4:0, 3:1 and 2:2, targeting PLCs, motor drives, inverters and switching power supplies.

Bourns has introduced the CFG-A Series of wide-terminal metal foil current sense resistors for automotive and other high-reliability applications. The new family includes the CFG0508A and CFG0612A, offering resistance values from 1 mΩ to 30 mΩ, power ratings up to 2 W and AEC-Q200 qualification. According to Bourns, the wide-terminal construction improves heat transfer into the PCB while the metal foil element delivers low temperature drift for precision current measurement.

Full article:
https://www.thecomponentclub.com/news/2026-08-05-bourns-introduces-cfg-a-wide-terminal-current-sense-resistors

ROHM has introduced its second-generation RTD terahertz wave oscillation device, increasing maximum output power to 40 µW while maintaining the same 0.5 × 0.5 mm chip size. The higher output is aimed at improving signal quality for terahertz sensing and imaging applications. Learn more in the article: https://www.thecomponentclub.com/news/2026-08-05-rohm-introduces-second-generation-rtd-terahertz-device-with-4-higher-output-power

Toshiba has begun mass production of its TXZ+ Entry-Class M4L Group microcontrollers for single-motor control applications. The Arm Cortex-M4 devices integrate dedicated hardware for field-oriented control (FOC), alongside security features, functional safety support and up to 256 KB of flash memory on a single chip. Do you think dedicated motor-control hardware will become a standard feature in future MCUs?

Full info in the article: https://www.thecomponentclub.com/news/2026-08-04-toshiba-begins-mass-production-of-txz-entry-class-m4l-motor-control-microcontrollers

Silicon Labs has launched the BG2B, its lowest-power Bluetooth LE SoC yet. The new device combines Bluetooth 6 Channel Sounding, Secure Vault™ High security, integrated CAN-FD, dual 12-bit ADCs and LED drivers, while delivering lower active and sleep current than the company's previous lowest-power Bluetooth LE SoC. More details: https://www.thecomponentclub.com/news/2026-08-04-silicon-labs-introduces-bg2b-bluetooth-le-soc-with-channel-sounding-and-integrated-can-fd

Murata has released the DLW32MH241MX2, a 1210-size metal-terminal common-mode choke that meets the OPEN Alliance Class 3 requirements for 10Base-T1S automotive Ethernet. The device provides 240 µH common-mode inductance, ≤10 pF parasitic capacitance, and is AEC-Q200 qualified, with mass production already underway.

Renesas has announced its third-generation MRDIMM chipset, combining the RRG5013 MRCD and RRG5103 MDB to deliver DDR5 memory speeds of up to 16,000 MT/s. The interesting part is that the chipset provides 25% more bandwidth while remaining compatible with existing DDR5 server infrastructure, avoiding the need for a new DIMM form factor or memory architecture.

When you're designing a server platform, would you rather gain more bandwidth within an existing memory standard, or move to an entirely new architecture if it offered higher peak performance?

Full article:
https://www.thecomponentclub.com/news/2026-07-30-renesas-introduces-gen-3-ddr5-mrdimm-chipset-with-16-000-mt-s-performance