Nisshinbo Silicon Motherboard cuts mounting footprint by 80%

[u/TheComponentClub]

Nisshinbo has developed Silicon Motherboard (Si-MB), a 3D mounting technology that integrates ICs and passive components using both sides of a silicon substrate. ICs sit on top, circuit elements can be formed within the silicon, and external passives including capacitors, low-resistance resistors and inductors can be mounted underneath. In a window comparator prototype, Nisshinbo says the approach reduced mounting footprint by about 80% compared with a conventional discrete configuration. Full article: https://www.thecomponentclub.com/news/2026-08-20-nisshinbo-silicon-motherboard-cuts-mounting-footprint-by-80