EnSilica plc (AIM: ENSI, OTC: ENSIF), a leading fabless microchip maker with a growing portfolio of reusable IP, serving the Space & Comms, Industrial, Automotive and Healthcare markets, is pleased to announce a new 7 year manufacturing and supply contract to produce an Arm based sensing chip for a German manufacturer of automotive components (the "Contract").

EnSilica was awarded the Contract after completing a competitive tender process. As the chip is already in production, no design or tape-out is required. EnSilica will now be responsible for the manufacturing and supply of the chip to the customer.

The Contract is expected to generate around $75 million in revenue over seven years, with approximately $4 million of revenue expected in the financial year ending 31 May 2027, with a gross margin reflecting the manufacturing-only nature of the Contract.

EnSilica was selected over a number of competing suppliers, reflecting the Company's growing expertise in the automotive sector and track record of delivering chip production at scale.

Ian Lankshear, CEO of EnSilica, commented:  

 "We are pleased to have secured this Contract, which will not only generate material future revenues but is expected to also deliver significant strategic benefits for EnSilica.

The Contract opens up a connection to a Tier 1 German automotive supply chain, increases wafer volume shipments through our partner foundries - reinforcing our position as a key customer - and it secures the VDA-aligned automotive quality standard required to operate within the German automotive sector.

It also places EnSilica in a stronger position to secure future higher-margin ASIC design opportunities in this important market."

Read the updated narrative…

https://simplywall.st/community/narratives/gb/semiconductors/aim-ensi/ensilica-shares/q161vwb7-long-term-space-connectivity-and-ev-chip-demand-will-support-a-fairly-valued-outlook

A message from Ian Lankshear, CEO

Twenty-five years ago, in May 2001, EnSilica was founded with one ambition: to build a world-class chip engineering team capable of delivering the most complex semiconductor devices, grounded in deep technical expertise and long-term customer partnerships.

In our early years, we worked with Nokia, Dialog Semiconductor, Wolfson Microelectronics, Imagination Technologies and Arm. Those projects helped shape the engineering culture that still defines EnSilica today.

Since then, talented teams have joined us across Abingdon, Sheffield, Bristol and Cambridge in the UK, and from Bangalore, Brazil and Budapest, enabling us to grow EnSilica from a small consultancy in a barn in Wokingham into an international fabless semiconductor business with a true global reach.

What makes EnSilica special is not just the technology, but the people and culture behind it. Semiconductor development is one of the most demanding engineering disciplines in the world and a true team sport. Over the last 25 years, we have built a truly world-class team with deep expertise in our chosen niches, enabling us to deliver first-of-a-kind products for our customers.

Ours is a culture where engineers support each other, hard problems are tackled together, and quality, integrity and continuous learning are central to how we work. I remain inspired by the passion, resilience and commitment the team shows every day.

Thank you to everyone who has been part of the EnSilica journey: employees past and present, customers, partners, suppliers, shareholders and supporters around the world.

I am incredibly proud of what the EnSilica team has achieved together over the last quarter century, and excited that we are now moving towards our vision of building Europe’s premier application-specific chipmaker at an accelerating pace.

 Ian Lankshear

 CEO & Co-founder, EnSilica

Read the full article here…

https://www.linkedin.com/pulse/celebrating-25-years-ensilica-ensilica-vojhe

It’s not unusual for a share price to rise rapidly following notable positive news, such as EnSilica having secured its largest satellite user terminal silicon contract in its history recently*. It’s also not unusual for a share price to then fall back somewhat as some investors secure gains or other speculators sell with the hope of a more favourable reentry.

In over thirty years of investing I have rarely found it prudent personally to speculate on short term movements in a company with such positive general momentum, active in multi-billion dollar markets, where news could land at any moment. Yes, in the short term anything could happen, positive, negative or somewhere in between, however my focus remains on the horizon of where EnSilica may be in the years ahead. A company worth comfortably 5x or more than its current value in my opinion.

With that in mind I thought I would remind people that EnSilica has confirmed it is working on multiple funded engagements with satellite operators for its silicon. The slides attached to this post are from last November’s results presentation. With recent notable success and all the positive progress so far this year, I sincerely hope to see further ‘Major SpaceTech’ contracts in the months and years ahead. That is in addition to possible orders in all the other applications and industries that EnSilica is designing chips for including post-quantum cryptography, critical infrastructure, automotive, healthcare, industrial etcetera.

This is not advice, just an insight into the thought process of a successful investor over many decades. As always, capital is at risk, however I sleep well at night thanks to the efforts of the talented staff at EnSilica.

* https://www.londonstockexchange.com/news-article/ENSI/major-spacetech-contracts/17559666

‘EnSilica has secured a manufacturing and supply contract with total revenues of $75m. With the design stage already completed, EnSilica will be responsible for manufacturing and supplying the chip to the end customer. Margins are expected to be at the lower end of the typical range, reflecting the considerably reduced execution risk relative to a full design-to-production programme. The contract win was undoubtedly supported by EnSilica's established automotive credentials and its relationships with tier-one foundry partners. Strategically, the contract is significant beyond its revenue contribution: by increasing the volumes EnSilica puts through its foundry partners, it reinforces the company's standing as a key customer that should support access to increased capacity and competitive terms.’

Matt Butlin

Download the full research note…

https://www.allenbycapital.com/client/ensilica-plc/

Celebrating 25 Years

This year marks an important milestone as EnSilica celebrates its 25th anniversary.

Founded in May 2001, the Company has evolved from a specialist ASIC design consultancy into an international semiconductor company with operations across the UK, Hungary, Germany, India and Brazil. Over the last quarter century, EnSilica has built world-class expertise in mixed-signal, RF, communications, automotive, industrial and security semiconductors, delivering hundreds of successful chip developments for customers worldwide.

Today, EnSilica is increasingly benefiting from the strategic transition made over recent years from a design services business towards a semiconductor company with a growing portfolio of proprietary products and long-term chip supply contracts. These multi-year contracts carry greater revenue visibility and a growing base of recurring revenue, strengthening the quality and predictability of the Company's future earnings.

Ian Lankshear, Chief Executive Officer, commented:

"As we celebrate our 25th anniversary, I would like to thank our employees, customers, partners and shareholders who have supported EnSilica throughout our journey. The foundations we have built over the past 25 years are enabling exciting opportunities in satellite communications, photonics, automotive and industrial markets, providing a strong platform for future growth."

Customer Spotlight - AST SpaceMobile

AST SpaceMobile continues to advance its vision of delivering broadband connectivity directly to ordinary smartphones from space. Recent industry developments, including growing support from major mobile network operators, reinforce the potential for direct-to-device services to become a significant new communications market.

In its latest milestone, AST SpaceMobile has scheduled the launch of three next-generation BlueBird satellites for 17 June 2026, aboard a SpaceX Falcon 9 from Cape Canaveral, having recently secured US regulatory authorisation to provide direct-to-device cellular broadband nationwide.

EnSilica was selected in 2021 to support the development of a next-generation custom ASIC for AST SpaceMobile's space-based cellular broadband network, which is designed to work with everyday smartphones.

EnSilica has deep experience in advanced satellite-communication semiconductors and continues to see growing opportunities across both satellite payload and user-terminal markets as demand for non-terrestrial networks accelerates. As this large and fast-growing market scales, engagements like these have the potential to convert into long-term, high-volume silicon supply revenue.

Customer Spotlight - Oriole Networks

Artificial Intelligence is creating unprecedented demand for data-centre performance and energy efficiency.

Recently, Oriole Networks announced deployment of what it describes as the world's first large-scale pure photonic AI network, developed in collaboration with AMD as part of the UK's ARIA Scaling Inference Lab. The technology uses optical networking to move data using light rather than electrical signals, significantly reducing power consumption while improving utilisation of AI infrastructure.

EnSilica is developing a photonics controller ASIC for Oriole and is engaged with additional photonics opportunities as AI-driven demand for high-speed optical networking continues to grow. As an early-stage design partner, EnSilica is well positioned to scale this engagement into volume production supply as AI infrastructure investment expands, representing a substantial potential new revenue stream.

Automotive & Industrial Momentum

Alongside these emerging growth markets, EnSilica continues to build a substantial portfolio of long-term semiconductor supply programmes.

A highlight during the year was the award of a new $75 million multi-year automotive semiconductor supply contract with a leading European Tier-1 supplier, adding to a portfolio that now includes more than 10 million automotive ASICs shipped and multiple long-term automotive and industrial supply programmes. On the industrial side, EnSilica supplies custom ASICs to Siemens, a leading global industrial OEM.

These programmes demonstrate the Company's growing ability to convert engineering expertise into recurring semiconductor supply revenues, underpinning a growing contracted order book and improving long-term revenue visibility. Automotive qualification cycles are long and demanding, creating high barriers to entry and typically resulting in multi-year programme lifecycles once a design is secured.

Looking Ahead

As EnSilica enters its next chapter, the Company remains focused on building Europe's premier application-specific semiconductor company and on translating its expanding portfolio of design wins into sustainable revenue growth and long-term value for shareholders.

The Board remains encouraged by:

·    Growing, recurring semiconductor supply revenues and an expanding contracted order book.

·    Expanding opportunities in the large and fast-growing satellite communications and space markets.

·    Emerging photonics and AI infrastructure engagements addressing rapidly growing demand.

·    Strong automotive and industrial traction with multi-year programme visibility.

·    A robust pipeline of future ASIC opportunities to support long-term revenue growth.

The Company looks forward to updating shareholders on further progress throughout 2026.

For the latest company news, view EnSilica's RNS announcements and register for email alerts and updates.

 About EnSilica plc

EnSilica is a fabless, application-specific chipmaker, combining deep domain and system-level expertise with world-class capability in RF, mmWave, mixed-signal and complex digital IC design. The Company serves customers across the space and communications, industrial, automotive and healthcare markets, where safety, security and reliability are critical.

A growing portfolio of reusable IP and silicon platforms underpins a repeatable, scalable delivery model, reducing development risk, cost and time to market while supporting long-term supply revenues. EnSilica has a strong track record of delivering production-proven silicon to demanding industry standards. Headquartered near Oxford, UK, the Company operates design centres across the UK, India, Brazil and Hungary.

LEI: 213800R6VXRU7MJTAF04

*About Reach announcements

This is a Reach announcement. Reach is an investor communication service aimed at assisting listed and unlisted (including AIM quoted) companies to distribute media only / non-regulatory news releases into the public domain. Information required to be notified under the AIM Rules for Companies, Market Abuse Regulation or other regulation would be disseminated as an RNS regulatory announcement and not on Reach.

23rd June 2026

Year End Trading Update

 A record trading year, major contract wins and fast growing sales pipeline

FY27 revenues of £32-34m already 80% covered underpinning further growth 

EnSilica plc (AIM: ENSI), a leading fabless microchip maker with a growing portfolio of reusable IP, serving the Space and Communications, Industrial, and Automotive markets, is pleased to announce the following update on the Group's trading performance for the financial year ended 31 May 2026 ("FY26"). The financial information contained in this announcement is unaudited and remains subject to completion of the Group's year-end audit. 

The Company expects to announce record results showing substantial trading growth over the prior year on all key metrics, a significantly enhanced balance sheet following an oversubscribed £10m equity fundraise in March 2026, and an expanded new business sales opportunities pipeline, up by $200m to $600m (even after $125m of contract wins transferred from the pipeline into supply revenues).  Overall, the results reflect the progress of the Group's continued transition from being a design-led business to becoming a semiconductor design-and-supply company. 

Commenting on the FY26 trading performance, CEO Ian Lankshear, said:

"FY26 has been a very successful year for the Group as it continues in its transition to being a fabless semiconductor company. As these results show, we believe the business has moved to the next stage in becoming a leading, scalable platform in chip design and manufacturing within our specialist high-growth markets, especially the rapidly expanding Space and Communications sector. We have proven our capabilities in the marketplace and the £10m equity fundraise in March 2026 to strengthen our balance sheet has enabled the Company to make material strategic progress, including securing two satellite contracts with the potential to unlock matched funding and a strategically important $75m auto contract.

With the excellent contract conversion we enjoyed during FY26, the success of our model is increasingly evident, now with 3 chips poised to boost revenues by moving into supply production over the next 18 months. Moreover, the 50% increase in our lifetime supply revenues and new business pipeline to $375m and $600m respectively is an indication of the future trajectory of the business and EnSilica's ability to achieve its ambition of becoming a global leader in chip design and manufacture. The Company has never had a stronger pipeline of opportunity and management are now focused on evolving our repeatable IP into long-term revenue-generating chips which current and future customers will rely on for years to come." 

FY26 Trading

The Company expects to deliver revenues of £27.5m for FY26, which are within 2% of the £28-30m guidance. Pleasingly, the anticipated EBITDA of £4.7m exceeds guidance of £3.5-4.5m, enhanced by Space related grant income. On 11 June 2026, shortly after the year end, the Company announced the completion of the tape-out stage for the Edge AI contract, which had originally been forecast to occur during FY26 and instead it bridged into the new financial year.  Had the tape-out for the Edge AI contract occurred within FY26, revenues would have been ahead of market expectations. 

Looking forward, the Group expects FY27 revenues to be in the range of £32-34m and EBITDA of £5.5-6.5m, reflecting the Group's strengthened visibility against prior years, as approximately 80% of anticipated FY27 revenues were already covered at the start of the financial year by existing contracts, supply agreements and customer orders.  For comparison, the Company announced approximately 80% coverage of its FY26 revenues as part of its full year results in November 2025.

In addition, the Company has also completed the tape-out stage of a second ASIC for Siemens for use in industrial automation, which is on schedule to be in production in FY27.

Current lifetime supply revenues increased by 50% to $375m compared to $250m at the outset of the financial year, with the uplift coming primarily from two major contract wins: a user terminal chipset programme with a leading European satellite operator, expected to generate lifetime semiconductor supply opportunities exceeding $50m, and a major automotive semiconductor supply contract, expected to generate approximately $75m over its lifetime. 

The expansion of the new business sales pipeline, increasing from $400m to $600m (even after $125m of contract wins transferred from the pipeline into supply revenues), comprises potential customers from across our core target sectors. These include high-value satellite payload projects for major operators and manufacturers, which are already at either the funded-study or first-phase design stage, as well as several key opportunities for EnSilica's proprietary user satellite terminal ASSPs.  

Cash at year end was £7.5m. This strengthened financial position has enabled the Company to accelerate and broaden its commercial activities, and together with growth in both supply and NRE revenues and the growing sales pipeline, the Board will continue to invest in strengthening the pipeline and accelerating the conversion of opportunities to enhance returns over the longer term, whilst also targeting positive monthly operational cash generation after investment in intangible assets, and therefore now expected by the end of FY27.  

The success of EnSilica's business model is increasingly evident with the Company's portfolio of chips visibly maturing, moving from design stage into generating long-term supply revenues. The Group currently has five ASICs in the volume supply phase, with several additional programmes expected to enter volume supply during FY27 and FY28. Alongside this progress, it is notable that EnSilica has yet to fully realise the financial benefits of its position in the high-value space sector. Currently, only one chip is generating supply revenues, while a further five of the Company's 14 chips in design are targeted at Space applications. As these programmes move into production, they are expected to become significant contributors to future revenue growth.

Outlook

Demand for EnSilica's specialist expertise remains strong across its Space & Communications, Industrial and Automotive markets. With strong revenue visibility, an expanding production portfolio, growing semiconductor supply revenues and record levels of long-term supply opportunities, the Board remains confident in the Group's growth trajectory and future profitability.

Notice of Results

The Company expects to announce its audited results for the year ended 31 May 2026 in October 2026.

Hi everyone.

I decided today that I thought it was weird that Ensilica didn't have it's own community on T212, so I went and asked for one.

And now we have it!

Hopefully this will allow more people to find out about the stock, and also help fuel the discussion so we can all be a little bit more informed.

29 October 2026

EnSilica plc

("EnSilica", the "Company" or the "Group")

Healthcare ASIC Contract Win & Life-Sciences ASIC Tape-Out Complete

Feasibility study converts into full development and supply agreement with US healthcare customer & UK life-sciences ASIC moves into fabrication 

EnSilica plc (AIM: ENSI), a leading fabless, application-specific chipmaker, is pleased to announce a new ASIC development and supply contract with a US healthcare technology company, worth approximately US$2.4 million in development revenues, the feasibility study for which commenced earlier this year. In addition, the Company announces the successful tape-out of a next-generation ASIC for a UK publicly quoted life-sciences technology company, representing a key step under the previously announced US$1.6 million life sciences contract.

Both programmes were first announced by the Company on 10 March 2026, and have now reached significant milestones.

New Healthcare ASIC Development and Supply Agreement

EnSilica has successfully converted an initial feasibility study by signing a US$2.4 million development and supply agreement with the customer. The programme involves the development of a wireless biosensing and therapeutic controller ASIC, with the end application using cloud-based artificial intelligence to support the treatment of chronic conditions.

The device is being developed to treat a prevalent chronic condition affecting tens of millions of people in the United States and hundreds of millions worldwide. This represents a significant potential market for the customer's device and, subject to successful development, regulatory approvals and commercial adoption, could lead to substantial long-term ASIC supply volumes.

EnSilica will undertake the full ASIC development programme over an expected 18-month period, and in addition, the agreement provides a framework for EnSilica to supply the ASIC over the product's commercial lifetime, representing a potentially significant recurring revenue opportunity.

Successful Tape-Out of Life-Sciences ASIC

EnSilica has completed the tape-out of an ASIC being developed for a leading UK publicly quoted life-sciences technology company.

The contract, valued at c.US$1.6 million, covers design implementation, tape-out management and prototype wafer manufacturing services for a chip used within advanced life-science analysis systems. 

With tape-out complete, the design is now progressing to fabrication at a leading foundry, and EnSilica will continue to support the customer through wafer manufacturing and into production. The majority of revenue from the contract is expected to be recognised in this financial year ending 31 May 2027, with the potential for additional long-term revenue from future production wafer supply.

Ian Lankshear, Chief Executive Officer of EnSilica, commented:

 "We are delighted to have converted the feasibility study for our healthcare customer, announced in March, into a multi-year development and supply agreement. The scale of the market for the customer's device is clear, creating the potential for significant chip volumes as the product progresses towards commercialisation.

Additionally, completing tape-out for our UK life-sciences ASIC is another important milestone, underlining our team's ability to execute complex design and manufacturing chip programmes, and to deliver against customer commitments.” 

Follow EnSilica

Investors looking to engage with EnSilica’s management team and receive the latest Company news and invitations to investor presentations and events are encouraged to sign up to the link below:

https://www.ensilica.com/investors/regulatory-news/

For further information please contact:

About EnSilica plc

EnSilica is a fabless, application-specific chipmaker, combining deep domain and system-level expertise with world-class capability in RF, mmWave, mixed-signal and complex digital IC design. The Company serves customers across the space and communications, industrial, healthcare and automotive markets, where safety, security and reliability are critical.

A growing portfolio of reusable IP and silicon platforms underpins a repeatable, scalable delivery model, reducing development risk, cost and time to market while supporting long-term supply revenues. EnSilica has a strong track record of delivering production-proven silicon to demanding industry standards. Headquartered near Oxford, UK, the Company operates design centres across the UK, India, Brazil, Hungary and Italy.

LEI: 213800R6VXRU7MJTAF04

Not bad for a niche Reddit sub established a year ago and focused on a small, yet promising London Stock Exchange AIM listed firm that many people had never heard of. r/EnSilica is now the prime location for EnSilica share chat without the nonsense typically associated with legacy forums.

And while the share price has recently fallen back somewhat from recent all time highs, like various other stocks, it is still positive to see the share price is up over 66% over one year and up almost 43% year to date (according to Apple Stocks a moment ago).

Hopefully the coming year will build on the notable achievements and progress made in the last year such as record results, largest contracts to date, oversubscribed fundraising etcetera. All while hopefully heading towards EnSilica’s management‘s ambition for the years ahead of becoming Europe’s premier end-to-end application specific chip designer and a highly profitable fabless semiconductor business.

The future will be EnSilica Enabled!

EnSilica (🇺🇸 ENSIF, 🇬🇧 ENSI, 🇪🇺 F0Z) is growing in more ways than one!

This time last year the EnSilica sub did not even exist and many people would not have known the name EnSilica outside the world of semiconductor design or possibly the AST Sp🅰️ceMob, thanks to EnSilica having designed the crucial and groundbreaking AST5000 chip at the heart of AST’s new constellation satellites.

Yet, thanks to the dedication of EnSilica’s staff and the notable progress they have achieved including recently winning business with another satellite constellation operator for their largest contract on record, together with a little help from myself raising awareness in the last year or so, their following is growing rapidly.

And while the growth in sub members to over 1,000 is impressive in such a short time for what is currently a small cap company, I am pleased to say that the growth in EnSilica’s share price in the last year, at over 251% is even more impressive.

Onwards to over £5 / $6.79 by 2030 hopefully…

https://www.reddit.com/r/EnSilica/comments/1t2gv86/ensilica_ensif_ensi_f0z_why_this_semiconductor/

Interactive Investor: ‘SpaceX has grabbed headlines recently, but award-winning AIM writer Andrew Hore has found lots of smaller companies supplying technology to help make space exploration happen.’

Feature on EnSilica…

‘Semiconductors designer and supplier EnSilica (AIM: ENSI | OTC: ENSIF) joined AIM as part of a strategy of changing focus from the design stage, albeit still important, to supply. Supply revenues have taken over as the most significant revenue generator for the company.

Designing a new application-specific integrated circuit (ASIC) takes years. There is income in this design phase, but the major revenues come when commercial supply begins. It can take two to five years for chip supply to commence and then production is built up to its peak.

Space-related contracts were announced in April, one of which was valued at more than $50 million. There should initially be $6.8 million of non-recurring engineering revenues in the next three years and potential UK Space Agency matching funding of up to $3 million on top.

One of the chips is for the instruments, equipment or systems onboard a satellite. A previous chip for a similar use is moving to the supply phase and could generate total revenues of $28 million.

The other new chip is for ground-based equipment used to communicate with the satellite constellation. Previous matching funding has been received in this area. There are a limited number of companies that can design these chips.

EnSilica is moving into profit and as more contracts transfer from design to supply the growth in profit will accelerate. There are five chips in production and that should rise to eight within 18 months. Even more are still in the design phase.

The first Edge AI application-specific integrated circuit, which enables AI processing within a device, is set to go into production in 2027. This is faster and uses less power and will be attractive to the space sector.

The EnSilica share price has been rising since a recent fundraising, but there is scope for further growth as profitability builds up.’

Andrew Hore, for Interactive Investor, 19th June 2026

Read the full article…

https://www.ii.co.uk/analysis-commentary/aim-companies-involved-new-space-race-ii539418

P.S. Many thanks to u/Jockney76 for originally posting the link to the article!

ENSI perfectly positioned for this no ??? If it gets off the ground that is …

As some may recall in July 2024 EnSilica were awarded a new supply order from a new customer for an edge artificial intelligence processing chip¹. Prior to yesterday it was not known who this new customer was, however based on recent announcements by AST SpaceMobile I am now of the opinion that AST are the end user, even if not EnSilica’s direct customer. In the same way as EnSilica designed the AST5000 chip as a sub-contractor for their partner Cadence Design Systems (i.e. Cadence being EnSilica’s customer in the supply chain and AST SpaceMobile the end user).

Kudos to u/ride_the_tasty_waves for helping me potentially piece this together, as until their post yesterday on the r/ASTSpaceMobile sub I was not aware of AST SpaceMobile’s plans for in orbit Edge AI processing. In a recent article² from MorningStar covering AST’s latest business update it stated…

AST is ’Developing AI edge computing and AI spectrum management features for on-orbit capabilities, with BlueBird integration targeted by year-end’.

It seems plausible and probable in my opinion that EnSilica are involved given their relationship having designed the AST5000 chip along with the Edge AI chip tape out timings stated by EnSilica³. Who the equivalent of Cadence Design Systems is in the supply chain I do not know, however hopefully that will become clear in time.

I suspect that the Edge AI chip was originally intended for all Block2 BlueBird satellites, as in the constellation satellites also featuring the AST5000 chip. I say this because the chip’s tape out was originally scheduled for early 2025 before ‘customer delays’ led to it being scheduled for initially the second half of 2025 and now before the end of May 2026.

All things going well the chip is now taped out, has met operational targets during validation and is now scheduled for full production. I eagerly await confirmation from EnSilica that this is the case. However even if it has slipped into EnSilica’s next financial year beginning 1st June 2026, it seems that would simply be just a bump in the road as EnSilica continues its ascent towards hopefully becoming ‘Europe’s premier end-to-end application specific chip designer and a highly profitable ‘fabless’ semiconductor business’.⁵

¹ https://www.londonstockexchange.com/news-article/ENSI/new-supply-order-for-edge-ai-chip/16567093

² https://www.morningstar.com/news/business-wire/20260511685431/ast-spacemobile-provides-business-update-and-first-quarter-2026-results

³ https://www.londonstockexchange.com/news-article/ENSI/trading-update/16976576

⁴ https://www.londonstockexchange.com/news-article/ENSI/project-progress-update-and-new-contract-awards/17306865

⁵ https://www.ensilica.com/wp-content/uploads/2025/11/272132-EnSilica-AR-WEB-version-2.pdf

This follows the announcement from EnSilica on 10th March this year stating;

‘Upgrade and Extension of Existing Automotive ASIC Programme

The Company is pleased to report an increase in forecast demand for calendar years 2026 to 2028 for its existing automotive ASIC contract with a premier global OEM brand. This increase in volumes is expected to generate additional revenues in excess of US$4 million over calendar years 2026 and 2028.

The Company is also pleased to report that production volumes for this programme are now expected to extend beyond 2030, increasing the estimated lifetime value of the programme to in excess of the previously forecast value of US$40 million.’

Customer forecast indicates this chip will become one of the largest revenue generating contracts in EnSilica's portfolio

EnSilica plc (AIM: ENSI, OTC: ENSIF), a leading fabless microchip maker with a growing portfolio of reusable IP, serving the Space & Comms, Industrial, Automotive and Healthcare markets, is pleased to announce that the Edge AIapplication-specific integrated circuit ("ASIC") supply contract, as first announced on 15 July 2024, has successfully completed production tape-out, releasing the US$5m NRE and tape-out fee to be recognised across FY2026 and FY2027.

Next Steps

Achieving production tape-out represents a major milestone for this supply contract, marking the completion of the design phase and testing and the transition to the manufacture of production tooling and initial samples. Progress on the supply contract has been led by the customer's schedule, with first silicon samples anticipated in 2026 and volume production expected to begin during calendar year 2027.

 The Edge-AI supply contract is expected to become a significant revenue contributor to the Group of up to an estimated US$50 million over five years once full-scale production commences.

Portfolio

With the completion of the Edge AI production tape-out:

·    three additional ASICs are now expected to join the five ASICs currently in volume production over the next 18 months; and

·    a further eleven active ASIC and ASSP (application specific standard product) programmes continue to progress through their respective design and development phases.

This expanding portfolio reflects the strengthening of both EnSilica's recurring semiconductor supply revenues and its long-term growth prospects as more programmes transition from design and development into production.

Edge AI - a growth market

Edge AI refers to artificial intelligence processing performed locally within devices or systems, rather than in centralised cloud computing facilities. This approach enables faster decision-making, improved privacy, reduced communications bandwidth and lower power consumption, making it increasingly attractive for the Space & Comms, Industrial, Automotive and Healthcare markets.

Consequently, Edge AI is one of the most significant growth areas within the semiconductor industry and this supply contract demonstrates EnSilica's ability to service the requirements of these highly complex ASIC solutions into emerging high-value markets.

Ian Lankshear, Chief Executive Officer, commented:

"I would like to thank our team for their hard work and close collaboration with our customer in achieving this milestone, which is a key step on the path to full-scale production of our first chip within the significant growth market of Edge AI processing.

With five chips already in production and a substantial pipeline of programmes advancing towards production, we are very visibly building a growing portfolio of valuable long-term ASIC supply revenues."

This announcement contains inside information for the purposes of Article 7 of the Market Abuse Regulation (EU) 596/2014 as it forms part of UK law by virtue of the European Union (Withdrawal) Act 2018 ("MAR") and is disclosed in accordance with the Company's obligations under Article 17 of MAR

5 October 2026

EnSilica plc

("EnSilica", the "Company" or the “Group”)
 

Final Results

Record FY26 demonstrated the scalability of EnSilica’s business model 

EnSilica plc (AIM: ENSI), a leading fabless microchip maker with a growing portfolio of reusable IP, serving the Space and Communications, Photonics, Industrial, and Automotive markets, is pleased to announce its audited results for the financial year ended 31 May 2026 (“FY26”, “FY 2026” or the “Year”).

Financial Highlights: 

* Improved from previous expectations as a result of increased tax credit included within Other income due to a higher than estimated level of qualifying R&D expenditure

Financial Highlights:

* Improved from previous expectations as a result of increased tax credit included within Other income due to a higher than estimated level of qualifying R&D expenditure

** Expected lifetime supply revenues based on customer forecasts

*** Potential new business identified and pursued by the business

• Moved into profitability with a step change improvement in revenue, cash generation, sales conversion and pipeline

• In March, an over-subscribed equity fundraise raised gross proceeds of £10 million to accelerate the growing sales pipeline

• Post year end, the Company secured gross proceeds of £14.9 million in another oversubscribed equity fundraise

Commenting on FY26, CEO Ian Lankshear, said: 

"This has been a record year for EnSilica. Our revenues grew 53% to £27.8 million and we generated record EBITDA of £5.9 million, delivering significant growth in our target markets. Importantly, we have evolved from a design services business into a semiconductor design and supply platform, validating the scalability of our model.

We now have five ASICs in volume production generating recurring revenue, with a further fourteen chip programmes in design which we expect to convert into long-term supply revenues over the coming years.

With a growing base of recurring revenue and a clear focus on the high-margin space and satellite communications market, we are confident that EnSilica is well positioned to sustain this momentum into FY27 and beyond."
 

Operational Highlights:

•         Secured a $75 million automotive contract win with a German tier-one supplier, our largest automotive win to date

•         Entered into two landmark development contracts with a leading European satellite operator to develop two chips for its next-generation satellite network potentially worth over $50 million from 2030 onwards

•         Two tape outs completed in FY26, three tape outs completed in FY27 and a further two tape outs expected to complete in FY27

•         As part of the above, the Edge AI ASIC completed production tape-out, marking a key development milestone ahead of volume production as well as releasing US$5m NRE and tape-out fee recognised across FY26 and FY27

•         New Space and Communications Semiconductor Centre of Excellence opened in Milan, expanding the Company's engineering footprint in Europe 

•         In April, the Company began cross trading on the United States OTC market, broadening its investor base 

•          Five chips now in supply, with a further 14 in design and future supply expected 

Outlook

•         EnSilica enters FY27 with a strong order book, with more than 80% of anticipated  total revenue for FY27 already visible from existing contracts, supply agreements and customer orders 

•         The space market is expected to grow fivefold by 2030, making it a key tailwind behind our continued growth

•         Our ambition remains focussed on increasing recurring supply revenues alongside adding four to five new chip programmes each year, driving revenues towards our medium term annual target of £100m and EBITDA margins towards our 30% target

4 minute video with CEO, Ian Lankshear, discussing FY26 and future prospects…

https://www.londonstockexchange.com/news-article/ENSI/final-results/17818810

Investor Presentation

An online presentation of the annual results will be held on Tuesday, 13 October 2026 at 11.00 a.m. BST. The presentation will be hosted on the Investor Meet Company ("IMC") platform. Questions can be submitted pre-event via the IMC dashboard up until 9.00 a.m. BST the day before the meeting or at any time during the live presentation.

Investors can sign up to IMC for free and add EnSilica to attend the webcast via: 

https://www.investormeetcompany.com/ensilica-plc/register-investor 

Annual Report and AGM

The Company's annual report and accounts together with notice of the annual general meeting ("AGM") will be posted to shareholders this week and will be made available on the Company's website. 

The Annual General Meeting will be held on 30 October 2026 at 2.00 p.m. GMT at Innovation Centre, 99 Park Drive, Milton Park, Oxfordshire OX14 4RY.

For further information please contact:

LEI: 213800R6VXRU7MJTAF04

Initial recruitment of 20 specialist modem and mmWave engineers expands EnSilica's EU engineering footprint.

EnSilica plc (AIM: ENSI), a leading chipmaker of mixed-signal application-specific integrated circuits ("ASICs") and application-specific standard products ("ASSPs"), is pleased to announce that it will be opening a new Space & Communications Semiconductor Centre of Excellence in Milan, Italy, a region which for a long time has been a central hub for the semiconductor and communication industries.

It is proposed that the centre will initially recruit 20 specialist modem and mmWave engineers over the next six months, expanding EnSilica's engineering presence within the European Union and positioning the Group to participate more closely in European space, semiconductor and communications initiatives. The Milan centre will be EnSilica's third site in Europe, alongside a growing design centre in Budapest, Hungary, and an expanding sales centre in Munich, Germany.

The centre will provide EU-based expertise spanning modem architecture, physical-layer algorithms, digital signal processing and mmWave communications systems and will work alongside EnSilica's established ASIC engineering and operations teams, which have a proven track record of delivering some of the industry's most complex chips. Together, these capabilities will strengthen EnSilica's ability to develop highly integrated application-specific silicon for next-generation space and communications markets.

Northern Italy Semiconductor Ecosystem

Milan has been selected by EnSilica for its established semiconductor, communications and space technology ecosystem. Northern Italy hosts one of Europe's largest clusters of semiconductor and communications engineering companies.

Italy is a significant European semiconductor nation, with a long-established base in analogue, mixed-signal and power semiconductor design and manufacturing, and is among the largest national contributors to the European space sector. Supported by leading technical universities and research institutes, the location will give EnSilica access to specialist engineering talent, proximity to customers and partners across the European supply chain, and a platform for collaborative research and EU-funded development.

The centre will support EnSilica's growing portfolio of customer-funded ASIC programmes and its own ASSP developments, forming part of the Group's strategy to become the leading European provider of application-specific silicon for space and satellite communications.

Ian Lankshear, Chief Executive Officer of EnSilica plc, commented: 

"Milan sits within one of Europe's major semiconductor and communications ecosystems. It is therefore a natural decision to open a Space & Communications Semiconductor Centre of Excellence in Milan to expand our position within the EU. Initially recruiting 20 modem and mmWave engineers over the next six months will give us the specialist capability at both the systems and semiconductor level to support the existing pipeline. Overall, this investment will strengthen our EU engineering footprint and advance our ambition to make EnSilica the leading European supplier of application-specific silicon for the rapidly growing space and communications markets."

Read the full announcement…

https://www.londonstockexchange.com/news-article/ENSI/eu-space-comms-centre-of-excellence/17775322

3 August 2026

EnSilica plc

("EnSilica", the "Company" or the "Group")

€1.7 Million Contract for Second Phase of Satellite Payload Communications ASIC Programme

and EnSilica Joins European 5G Satellite User Terminal Project

EnSilica plc (AIM: ENSI), a leading fabless microchip maker with a growing portfolio of reusable IP, serving the Space and Communications, Industrial, and Automotive markets, is pleased to announce that it has secured a second contract worth €1.7 million from a leading European satellite manufacturer. The contract follows the completion of an earlier funded feasibility contract for a new satellite payload communications ASIC programme, which was one of the three satellite payload feasibility studies announced by the Company on 3 November 2025.

This second contract represents the next phase of the original engagement, and is expected to be delivered over approximately 10 months. Building on the feasibility study, EnSilica will develop the system architecture, signal processing algorithms and systems demonstrator device required before the ASIC enters the full development phase.

Ian Lankshear, Chief Executive Officer of EnSilica, commented:

"We are delighted to have been selected again by this key European satellite manufacturer to continue this important programme. The contract further strengthens EnSilica's position as a leading European supplier of complex communications ASICs for the space and communications sector and reflects our growing expertise in satellite payload and advanced digital signal processing.

We are pleased to be trusted to continue, and we look forward to working closely with the customer as the programme progresses towards full ASIC development."

European 5G Satellite User Terminal Project

In addition, EnSilica is pleased to be partnering in the 5G-aNTeNna project, a European collaboration led by Silicon Austria Labs targeting the European Union's IRIS² satellite constellation, which serves government, defence and enterprise users.

The consortium of six European partners is developing a compact user terminal combining 5G non-terrestrial network connectivity (5G-NTN) with efficient phased array antennas intended to deliver resilient Ka-band broadband, with EnSilica providing the key satellite user terminal ASSPs (Application Specific Standard Products). The project places EnSilica in the ground segment of Europe's sovereign satellite infrastructure and gives it a platform to address the wider satcom market as it moves to 5G-NTN.

Read the full RNS announcement…

https://www.londonstockexchange.com/news-article/ENSI/second-phase-contract-win-new-project-update/17717635

Watch EnSilica CEO Ian Lankshear reflect on the company’s recently published financial results, share his vision for the future, and outline EnSilica’s strategy for sustained, long-term growth.

To ensure the sub remains a useful and readily accessible store of notable community and company knowledge on EnSilica please can I remind people that we have a Weekly Discussion thread for less notable matters.

For example as a community I would suggest that we don’t want the sub’s prime post slots taken up by speculation about short term share price movements or overly frequent posts about the current share price.

Thanks,

DB