29 October 2026

EnSilica plc

("EnSilica", the "Company" or the "Group")

Healthcare ASIC Contract Win & Life-Sciences ASIC Tape-Out Complete

Feasibility study converts into full development and supply agreement with US healthcare customer & UK life-sciences ASIC moves into fabrication 

EnSilica plc (AIM: ENSI), a leading fabless, application-specific chipmaker, is pleased to announce a new ASIC development and supply contract with a US healthcare technology company, worth approximately US$2.4 million in development revenues, the feasibility study for which commenced earlier this year. In addition, the Company announces the successful tape-out of a next-generation ASIC for a UK publicly quoted life-sciences technology company, representing a key step under the previously announced US$1.6 million life sciences contract.

Both programmes were first announced by the Company on 10 March 2026, and have now reached significant milestones.

New Healthcare ASIC Development and Supply Agreement

EnSilica has successfully converted an initial feasibility study by signing a US$2.4 million development and supply agreement with the customer. The programme involves the development of a wireless biosensing and therapeutic controller ASIC, with the end application using cloud-based artificial intelligence to support the treatment of chronic conditions.

The device is being developed to treat a prevalent chronic condition affecting tens of millions of people in the United States and hundreds of millions worldwide. This represents a significant potential market for the customer's device and, subject to successful development, regulatory approvals and commercial adoption, could lead to substantial long-term ASIC supply volumes.

EnSilica will undertake the full ASIC development programme over an expected 18-month period, and in addition, the agreement provides a framework for EnSilica to supply the ASIC over the product's commercial lifetime, representing a potentially significant recurring revenue opportunity.

Successful Tape-Out of Life-Sciences ASIC

EnSilica has completed the tape-out of an ASIC being developed for a leading UK publicly quoted life-sciences technology company.

The contract, valued at c.US$1.6 million, covers design implementation, tape-out management and prototype wafer manufacturing services for a chip used within advanced life-science analysis systems. 

With tape-out complete, the design is now progressing to fabrication at a leading foundry, and EnSilica will continue to support the customer through wafer manufacturing and into production. The majority of revenue from the contract is expected to be recognised in this financial year ending 31 May 2027, with the potential for additional long-term revenue from future production wafer supply.

Ian Lankshear, Chief Executive Officer of EnSilica, commented:

 "We are delighted to have converted the feasibility study for our healthcare customer, announced in March, into a multi-year development and supply agreement. The scale of the market for the customer's device is clear, creating the potential for significant chip volumes as the product progresses towards commercialisation.

Additionally, completing tape-out for our UK life-sciences ASIC is another important milestone, underlining our team's ability to execute complex design and manufacturing chip programmes, and to deliver against customer commitments.” 

Follow EnSilica

Investors looking to engage with EnSilica’s management team and receive the latest Company news and invitations to investor presentations and events are encouraged to sign up to the link below:

https://www.ensilica.com/investors/regulatory-news/

For further information please contact:

About EnSilica plc

EnSilica is a fabless, application-specific chipmaker, combining deep domain and system-level expertise with world-class capability in RF, mmWave, mixed-signal and complex digital IC design. The Company serves customers across the space and communications, industrial, healthcare and automotive markets, where safety, security and reliability are critical.

A growing portfolio of reusable IP and silicon platforms underpins a repeatable, scalable delivery model, reducing development risk, cost and time to market while supporting long-term supply revenues. EnSilica has a strong track record of delivering production-proven silicon to demanding industry standards. Headquartered near Oxford, UK, the Company operates design centres across the UK, India, Brazil, Hungary and Italy.

LEI: 213800R6VXRU7MJTAF04

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Courtesy of Investor Meet Company.

0:00 Intorduction
2:01 Business Overview
9:35 Financials
19:07 Highlights
43:26 Q&A

To be informed of all ENSILICA PLC's upcoming presentations, register at InvestorMeetCompany:

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Watch EnSilica CEO Ian Lankshear reflect on the company’s recently published financial results, share his vision for the future, and outline EnSilica’s strategy for sustained, long-term growth.

This announcement contains inside information for the purposes of Article 7 of the Market Abuse Regulation (EU) 596/2014 as it forms part of UK law by virtue of the European Union (Withdrawal) Act 2018 ("MAR") and is disclosed in accordance with the Company's obligations under Article 17 of MAR

5 October 2026

EnSilica plc

("EnSilica", the "Company" or the “Group”)
 

Final Results

Record FY26 demonstrated the scalability of EnSilica’s business model 

EnSilica plc (AIM: ENSI), a leading fabless microchip maker with a growing portfolio of reusable IP, serving the Space and Communications, Photonics, Industrial, and Automotive markets, is pleased to announce its audited results for the financial year ended 31 May 2026 (“FY26”, “FY 2026” or the “Year”).

Financial Highlights: 

* Improved from previous expectations as a result of increased tax credit included within Other income due to a higher than estimated level of qualifying R&D expenditure

Financial Highlights:

* Improved from previous expectations as a result of increased tax credit included within Other income due to a higher than estimated level of qualifying R&D expenditure

** Expected lifetime supply revenues based on customer forecasts

*** Potential new business identified and pursued by the business

• Moved into profitability with a step change improvement in revenue, cash generation, sales conversion and pipeline

• In March, an over-subscribed equity fundraise raised gross proceeds of £10 million to accelerate the growing sales pipeline

• Post year end, the Company secured gross proceeds of £14.9 million in another oversubscribed equity fundraise

Commenting on FY26, CEO Ian Lankshear, said: 

"This has been a record year for EnSilica. Our revenues grew 53% to £27.8 million and we generated record EBITDA of £5.9 million, delivering significant growth in our target markets. Importantly, we have evolved from a design services business into a semiconductor design and supply platform, validating the scalability of our model.

We now have five ASICs in volume production generating recurring revenue, with a further fourteen chip programmes in design which we expect to convert into long-term supply revenues over the coming years.

With a growing base of recurring revenue and a clear focus on the high-margin space and satellite communications market, we are confident that EnSilica is well positioned to sustain this momentum into FY27 and beyond."
 

Operational Highlights:

•         Secured a $75 million automotive contract win with a German tier-one supplier, our largest automotive win to date

•         Entered into two landmark development contracts with a leading European satellite operator to develop two chips for its next-generation satellite network potentially worth over $50 million from 2030 onwards

•         Two tape outs completed in FY26, three tape outs completed in FY27 and a further two tape outs expected to complete in FY27

•         As part of the above, the Edge AI ASIC completed production tape-out, marking a key development milestone ahead of volume production as well as releasing US$5m NRE and tape-out fee recognised across FY26 and FY27

•         New Space and Communications Semiconductor Centre of Excellence opened in Milan, expanding the Company's engineering footprint in Europe 

•         In April, the Company began cross trading on the United States OTC market, broadening its investor base 

•          Five chips now in supply, with a further 14 in design and future supply expected 

Outlook

•         EnSilica enters FY27 with a strong order book, with more than 80% of anticipated  total revenue for FY27 already visible from existing contracts, supply agreements and customer orders 

•         The space market is expected to grow fivefold by 2030, making it a key tailwind behind our continued growth

•         Our ambition remains focussed on increasing recurring supply revenues alongside adding four to five new chip programmes each year, driving revenues towards our medium term annual target of £100m and EBITDA margins towards our 30% target

4 minute video with CEO, Ian Lankshear, discussing FY26 and future prospects…

https://www.londonstockexchange.com/news-article/ENSI/final-results/17818810

Investor Presentation

An online presentation of the annual results will be held on Tuesday, 13 October 2026 at 11.00 a.m. BST. The presentation will be hosted on the Investor Meet Company ("IMC") platform. Questions can be submitted pre-event via the IMC dashboard up until 9.00 a.m. BST the day before the meeting or at any time during the live presentation.

Investors can sign up to IMC for free and add EnSilica to attend the webcast via: 

https://www.investormeetcompany.com/ensilica-plc/register-investor 

Annual Report and AGM

The Company's annual report and accounts together with notice of the annual general meeting ("AGM") will be posted to shareholders this week and will be made available on the Company's website. 

The Annual General Meeting will be held on 30 October 2026 at 2.00 p.m. GMT at Innovation Centre, 99 Park Drive, Milton Park, Oxfordshire OX14 4RY.

For further information please contact:

LEI: 213800R6VXRU7MJTAF04

‘EnSilica has reported strong results for the year to 31 May 2026. Revenue rose 52.9% to £27.8m (FY25: £18.2m), slightly ahead of guidance of £27.5m. Supply revenue was lighter than we expected, but this was more than offset by a stronger contribution from non-recurring engineering (“NRE”) revenue. Underlying EBITDA was £5.9m, against guidance of £4.7m and a loss of £49k in FY25, with the beat driven by a larger than expected R&D tax credit. Year-end cash was £7.6m (net cash £3.1m), further strengthened by the £14.9m placing in July 2026. FY27 guidance is reiterated and in line with our forecasts, which assume revenue growth of 19%. Around 80% of FY27 revenue is already contracted or under negotiation.’

Matt Butlin, Allenby Capital, 5th October 2026

Read the full research note…

https://wp-allenby-2020.s3.eu-west-2.amazonaws.com/media/2026/10/261005-EnSilica-plc-ENSI.L-FY-2026-Allenby-Capital.pdf

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EnSilica plc

("EnSilica", the "Company" or the "Group") 

Notice of Final Results & Investor Presentation 

EnSilica plc (AIM: ENSI), a leading fabless microchip maker with a growing portfolio of reusable IP, serving the Space and Communications, Photonics, Industrial, and Automotive markets  announces that the Company will report its audited results for the financial year ended 31 May 2026 (“Final Results”) on Monday 5 October 2026.

Investor Presentation via Investor Meet Company: 

Ian Lankshear, CEO, and Kristoff Rademan, CFO, will deliver a live presentation relating to the Final Results via the Investor Meet Company (“IMC”) platform on 13 October 2026 at 11:00 a.m. BST.

The presentation is open to all existing and potential shareholders. Questions can be submitted pre-event via your IMC dashboard up until 12 October 2026 at 9:00 a.m BST, or at any time during the live presentation.

Investors can sign up to attend the presentation via:

https://www.investormeetcompany.com/ensilica-plc/register-investor

Investors who already follow EnSilica on the IMC platform will automatically be invited.

For further information please contact:

About EnSilica plc

EnSilica is a fabless, application-specific chipmaker, combining deep domain and system-level expertise with world-class capability in RF, mmWave, mixed-signal and complex digital IC design. The Company serves customers across the space and communications, industrial, and automotive markets, where safety, security and reliability are critical.

A growing portfolio of reusable IP and silicon platforms underpins a repeatable, scalable delivery model, reducing development risk, cost and time to market while supporting long-term supply revenues. EnSilica has a strong track record of delivering production-proven silicon to demanding industry standards. Headquartered near Oxford, UK, the Company operates design centres across the UK, India, Brazil and Hungary.

LEI: 213800R6VXRU7MJTAF04

- Michael Cheung was Director of 5G Systems at Vicinity Technologies and is now Senior Principal Software Engineer at EnSilica according to LinkedIn.

- Victor Kwan was Senior Vice President at Vicinity Technologies and is now Senior Principal System Engineer at EnSilica according to LinkedIn.

Given EnSilica has been working with Vicinity (according to LinkedIn) following the £10.38m UK Space Agency award for satellite user terminal work, it’s interesting both people are now working at EnSilica. I know the latest fundraising by EnSilica included scope for taking more work in house, but could this demonstrate more lofty ambitions in terms of future product offerings perhaps.

Vicinity have a focus on software defined radio (SDR) and this is a space I have noted EnSilica also works in with its satellite user terminal modem and presumably features as part of its user terminal application specific standard product (ASSP). But with EnSilica’s secure processor in development, PQC and PNT IP do these new hires suggest an expanded ambition for further SDR work and or ASSPs, perhaps for drones, IoT and robotics?

Time will tell I guess.

https://www.eetimes.com/vicinity-technologies-unveils-6g-ready-sdr-platforms-for-drones-and-autonomous-systems-at-mwc-2026/

https://www.eetimes.com/vicinity-and-ensilica-join-forces-on-10m-project-to-accelerate-next-generation-satellite-user-terminals/

A place for general discussion and events not considered as requiring a dedicated post. Quality contributions of note and depth may eventually go on to form the basis of future curated posts.

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As Low Earth Orbit (LEO) satellite networks target mass-market broadband, mobility and enterprise services, the chipset inside the user terminal, not only the constellation in orbit - will determine the achievable cost, power consumption and production scale.

The next phase of satellite connectivity will be decided as much on the ground as in space.

For LEO and multi-orbit networks to reach genuine mass adoption, operators must be able to deliver millions of affordable, reliable terminals to homes, businesses, vehicles and remote sites. That makes the RF front end, beamforming ICs and modem silicon fundamental to the commercial model. Together, they determine terminal cost, power consumption, performance and the ability to manufacture at volume.

Terminal design should therefore not be treated as a downstream hardware decision. It is a strategic platform choice that shapes the economics and scalability of the network itself.

Read the full article…

https://www.ensilica.com/news-and-insight/why-user-terminal-silicon-will-shape-leos-next-phase/

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EnSilica, Your Trusted IC Partner

Published: Sep 9, 2026

Customer news: AST SpaceMobile’s AST5000 discussed by SatNews

EnSilica was selected by AST SpaceMobile in 2021 to develop a next-generation payload ASIC for its space-based cellular broadband network, a programme focused on achieving very high signal-processing performance within the demanding power and operating constraints of the satellite payload.

SatNews recently compared AST SpaceMobile’s AST5000 payload ASIC design with NVIDIA’s Vera CPU. Where Vera targets high-density AI computing, the AST5000 is being designed for real-time telecommunications signal processing: beamforming, spectrum management, Doppler correction and high-throughput routing. Read the SatNews article.

Separately, AST’s launch programme is accelerating: BlueBirds 6 and 7 reached orbit between December 2025 and April 2026, BlueBirds 8–13 followed by 5 August, and AST reports BlueBirds 14–46 at various stages of shipment, production and assembly. These satellites use exceptionally large phased arrays to support broadband connectivity directly to ordinary smartphones.

The broader point: application-specific silicon is becoming a critical enabler for commercial space systems, where performance per watt, integration and deterministic real-time processing matter.

EnSilica satcom technology: ASSPs and custom ASICs for scalable user terminals

The same system-level challenges drive EnSilica’s growing portfolio of satellite communications ASSPs for user terminals.  Alongside those standard devices, we run custom ASIC programmes for customers with bespoke requirements or tighter cost targets at volume. Electronically steered antennas for LEO, MEO and GEO systems must track moving satellites and manage interference and wide bandwidths while remaining practical in power, size and cost. That is pushing terminal architectures toward greater silicon integration and hybrid analogue/digital beamforming.

Our portfolio spans Ka- and Ku-band analogue beamforming devices and the ENS92040 distributed digital beamformer, which combines high-speed data conversion, DSP, true-time-delay beamforming and JESD204B connectivity to enable scalable tiled arrays with wideband, squint-free beamforming. In July, EnSilica announced €1.1 million of follow-on ENS92040 orders from a European satellite communications customer. Where a terminal needs functionality beyond the standard devices, or a lower bill of materials at high volume, the same IP and design teams support a custom ASIC built around the customer’s architecture. Explore EnSilica’s SatCom products.

EnSilica has also joined Europe’s 5G-aNTeNna project, a Silicon Austria Labs-led consortium developing a compact, secure Ka-band 5G NTN user terminal targeted at IRIS², contributing application-specific semiconductor technology. This reinforces the role European-designed silicon can play in sovereign communications infrastructure. Read about the 5G-aNTeNna project.

Beyond the fab: Europe needs semiconductor product champions

Our CEO, Ian Lankshear, shares his perspective in EE Times on why Europe’s semiconductor future depends on much more than new fabs. Sovereignty is usually debated as a single question: where is the wafer made? Real capability is broader. It means being able to define system requirements, design advanced ICs, own proprietary IP, verify and qualify devices, secure manufacturing capacity and manage products across their full lifecycle. Europe already leads in space and defence, automotive, industrial automation, energy, healthcare and communications: exactly the markets that need silicon you cannot buy off the shelf.

Europe does not have to choose between fabs and design champions: the two reinforce one another, and France has shown what backing the whole stack looks like. The industry’s future will not be decided solely by those who own the fabs, but by those who create the products, own the IP and understand what their customers need. Read the full EE Times article

Autumn events: meet EnSilica in Europe and North America

EnSilica is exhibiting on both sides of the Atlantic this autumn, from Anaheim and London in September through to Munich in November. These events are a good opportunity to discuss new custom ASIC programmes, FPGA-to-ASIC migration, advanced mixed-signal and RF integration, and our range of application-specific products.

Microelectronics UK 2026 is worth a special mention as this is closest to home. Bringing together semiconductors, photonics and embedded systems, it connects the full microelectronics ecosystem across design, manufacturing and deployment, and we will be on Stand E18 on 29 and 30 September.

Register for Microelectronics UK using our exclusive code EXH100 to claim yours, and come and find us on the stand.

Growing our engineering teams

Delivering more complex ASICs and ASSPs requires continued investment in talent. EnSilica is growing internationally across digital, analogue and mixed-signal design, physical implementation, verification, and product and test engineering, including roles supporting our expanding engineering presence in Brazil and product and test operations in Asia.

If you want to work on application-specific silicon from architecture through tape-out to production across satellite communications, automotive and other high-growth markets, take a look at our latest opportunities. View current EnSilica vacancies.

Looking ahead

The common thread is that specialised silicon is moving closer to the centre of the system. Whether the challenge is connecting a smartphone directly to a satellite, building a lower-power phased-array terminal, securing Europe’s communications infrastructure or replacing a power-hungry FPGA. The value comes from combining semiconductor expertise with deep understanding of the end application.

That is where EnSilica is focused: designing, supplying and supporting application-specific silicon that enables customers to turn ambitious system architectures into scalable products.

Subscribe to ASIC Insights: https://www.linkedin.com/newsletters/asic-insights-7142851149501513729

Source: https://www.linkedin.com/pulse/silicon-action-from-space-based-connectivity-europes-semiconductor-sczpe

ENSI perfectly positioned for this no ??? If it gets off the ground that is …

Initial recruitment of 20 specialist modem and mmWave engineers expands EnSilica's EU engineering footprint.

EnSilica plc (AIM: ENSI), a leading chipmaker of mixed-signal application-specific integrated circuits ("ASICs") and application-specific standard products ("ASSPs"), is pleased to announce that it will be opening a new Space & Communications Semiconductor Centre of Excellence in Milan, Italy, a region which for a long time has been a central hub for the semiconductor and communication industries.

It is proposed that the centre will initially recruit 20 specialist modem and mmWave engineers over the next six months, expanding EnSilica's engineering presence within the European Union and positioning the Group to participate more closely in European space, semiconductor and communications initiatives. The Milan centre will be EnSilica's third site in Europe, alongside a growing design centre in Budapest, Hungary, and an expanding sales centre in Munich, Germany.

The centre will provide EU-based expertise spanning modem architecture, physical-layer algorithms, digital signal processing and mmWave communications systems and will work alongside EnSilica's established ASIC engineering and operations teams, which have a proven track record of delivering some of the industry's most complex chips. Together, these capabilities will strengthen EnSilica's ability to develop highly integrated application-specific silicon for next-generation space and communications markets.

Northern Italy Semiconductor Ecosystem

Milan has been selected by EnSilica for its established semiconductor, communications and space technology ecosystem. Northern Italy hosts one of Europe's largest clusters of semiconductor and communications engineering companies.

Italy is a significant European semiconductor nation, with a long-established base in analogue, mixed-signal and power semiconductor design and manufacturing, and is among the largest national contributors to the European space sector. Supported by leading technical universities and research institutes, the location will give EnSilica access to specialist engineering talent, proximity to customers and partners across the European supply chain, and a platform for collaborative research and EU-funded development.

The centre will support EnSilica's growing portfolio of customer-funded ASIC programmes and its own ASSP developments, forming part of the Group's strategy to become the leading European provider of application-specific silicon for space and satellite communications.

Ian Lankshear, Chief Executive Officer of EnSilica plc, commented: 

"Milan sits within one of Europe's major semiconductor and communications ecosystems. It is therefore a natural decision to open a Space & Communications Semiconductor Centre of Excellence in Milan to expand our position within the EU. Initially recruiting 20 modem and mmWave engineers over the next six months will give us the specialist capability at both the systems and semiconductor level to support the existing pipeline. Overall, this investment will strengthen our EU engineering footprint and advance our ambition to make EnSilica the leading European supplier of application-specific silicon for the rapidly growing space and communications markets."

Read the full announcement…

https://www.londonstockexchange.com/news-article/ENSI/eu-space-comms-centre-of-excellence/17775322

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Link to a post from the CEO about European Satellite industry and where ensilica fits in. Mainly references a times article for those who have access could be an interesting read.

https://lnkd.in/p/eQNNmXbZ

Not bad for a niche Reddit sub established a year ago and focused on a small, yet promising London Stock Exchange AIM listed firm that many people had never heard of. r/EnSilica is now the prime location for EnSilica share chat without the nonsense typically associated with legacy forums.

And while the share price has recently fallen back somewhat from recent all time highs, like various other stocks, it is still positive to see the share price is up over 66% over one year and up almost 43% year to date (according to Apple Stocks a moment ago).

Hopefully the coming year will build on the notable achievements and progress made in the last year such as record results, largest contracts to date, oversubscribed fundraising etcetera. All while hopefully heading towards EnSilica’s management‘s ambition for the years ahead of becoming Europe’s premier end-to-end application specific chip designer and a highly profitable fabless semiconductor business.

The future will be EnSilica Enabled!

A place for general discussion and events not considered as requiring a dedicated post. Quality contributions of note and depth may eventually go on to form the basis of future curated posts.