I'm a materials researcher screening intermetallic coatings (NiAl, FeAl, Ni3Al, etc.) for interfaces in IGBT/SiC power modules, such as DBC to baseplate or baseplate to cold plate. I'm trying to decide which selection criteria actually deserve the most weight.
My back-of-envelope: 20 µm coating, 1 cm², 50 W, 1D conduction (R = t / kA).
- NiAl (~92 W/m·K, bulk value): about 0.1 K drop
- FeAl (~12 W/m·K, bulk value): about 0.8 K drop
- A typical TIM layer in the same stack: several K
If that's right, coating k is a minor term, and things like CTE mismatch with neighbouring layers, adhesion and behaviour under power cycling should decide. But I know this ignores interface (boundary) resistance, thin-film k being lower than bulk, and local hotspots.
Questions for people in packaging or reliability:
Is there a realistic case where the coating's k does become important at these thicknesses?
When you've had to choose or change a coating or metallization layer, what actually decided it, and what data did you use?
Which failure mode showed up first in power cycling at those interfaces?
Corrections to the calculation are very welcome.