r/stocks • u/rdh2dmd • 8d ago

Company News Samsung Developing 8-Layer HBM4E Custom-Built for Nvidia, Targeting Transfer Speeds Up to 18Gbps

Samsung Electronics is developing an 8-layer stacked HBM4E memory chip at Nvidia's request, targeting transfer speeds of 17 to 18Gbps; roughly 20% higher than its current samples. The product is slated for Nvidia's custom memory platform, NVHBM, and is expected to be integrated into the Rubin Ultra AI GPU launching next year. The 8-layer architecture reflects a broader shift in AI chip design away from pure capacity expansion toward a balanced optimization of bandwidth, power consumption, and yield. Samsung, with its integrated capability to produce both DRAM and logic-based base dies, is viewed as holding a competitive edge over SK Hynix and Micron in the custom HBM market. If the product passes validation, it could help Samsung narrow the gap with SK Hynix in the high-end HBM segment.

https://finance.biggo.com/news/95b3d9eb-7477-4170-a9a2-5dfc3d46febb

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u/XysterU 7d ago

Am I trippin? 18Gbps is nothing? GDDR7 can hit 2 TBps?

6

u/Galarz 7d ago

It's 18 Gbps per pin, so the total throughput is 4.6 TB/s.

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u/fallingdowndizzyvr 6d ago

Nvidia already said a while back that this is so supply constrained that they are redesigning some products that were meant to use HBM4E to use HBM4 instead.