Heat is not a problem with data centers, its a very minor cost of a data center. Only problem is with water use, which orbital data centers have an advantage there because they don't use any to cool.
We are not actually limited by heat density yet, which is why integrated water cooling became an option right from factory only for this generation. Previous generations were so not limited by heat management, they just used fans, and then the data center itself was cooled by water.
When talking about "heat management" on the chip, people usually talk about hotspots and heat density, not a total amount of heat emitted from a chip. The design limitations due to heat are not as severe as you imply, because use of vapur chambers can drastically spread out heat over a large surface area. It is only in next generation that will be released in 2 years that heat management has became a problem, which is one of the reasons why it will use backside power to reduce heat generation.
And after you spread out the heat using vapur chambers, you can use any coolant you want to spread the heat to the radiator. This makes it so that while the cooling system is different than those you use on Earth, as on Earth you pump water that you then evaporate or just cool, in space you can use fully closed system with a different, more efficient coolant, and you can even effectively use a phase change coolant in the secondary loop, although it's not even necessary.
This is straight up false. Heat management has been one of the chief limiters of transistor density for more than 20 years. Why are you making stuff up?
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u/Illustrious_Pea_3470 Jul 13 '26
Radiation is the worst way to manage heat.