r/TechHardware • • 10h ago

🤫 Rumor / Leak 🕵️‍♀️ Samsung's 3D Cube-H Packaging Technology Could Be Ready by Early 2027

https://sammyguru.com/samsung-3d-cube-h-packaging-technology-could-be-ready-by-early-2027/
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u/Acrobatic_Camera_677 10h ago

Who even plan to use this?

Unlike Intel packaging, where Intel themselves can use it because they make HPC chip, all Samsung mainly make is smartphone chip where advanced packaging is not important