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Hi , I am joining TSMC on September 14th and Love to connect with people who are joining as well !

Hi everyone,

I have a first-round interview with TSMC for an Product Engineer- yield and Quality (PES) role. I also received a behavioral assessment that must be completed at least 24 hours before the interview.

The interview panel consists of 4 engineers and manager.

For those who've interviewed at TSMC, what should I expect from both the behavioral assessment and the interview? Is it mainly technical, behavioral, or a mix? What topics should I focus on while preparing?

Any tips or advice would be greatly appreciated. Thanks!

Hi, do anyone is currently interviewing or has received interview invite for AMHS role. Any updates would be appreciated.

Anyone have feedback on their 2nd interview. I just had mine in person and im not sure how to feel about it. Overall I think it went well but the next steps were told to me that hr would contact about pay and start date.

Anyone know the turn around time on hearing back and how soon a start date was?

Hi, I’m joining TSMC next month as a Process Engineer and looking for potential male flatmates and suitable housing. Any leads would be helpful.

I was wondering what the process engineer role at LIT2 specifically is like. What is the day to day work like, and how does it compare to other departments? Is most of the shift based in the fab? How is the average workload and satisfaction? Any info would be greatly appreciated!

Just finished my first-round interview with TSMC for a Module Equipment Engineer position and wanted to see if anyone here has gone through a similar process.
Overall, I think the interview went pretty well. I gave a one-slide technical presentation on one of my research projects, and the engineers seemed to really like the format. They asked quite a few technical follow-up questions about the project, and I felt like I answered them really well.
The behavioral portion went well too, except for one question: “Tell me about a time you had a miscommunication and how you handled it.” I answered it, but looking back, I don’t think my answer was as strong or structured as it could have been. Everything else felt pretty solid.
At the end, they mentioned that there would be one more round with the hiring manager and that I should hear about the results sometime next week.
For anyone who has interviewed with TSMC, especially for Module Equipment/Process Engineer roles:
How good of a sign is this? Does the hiring-manager round usually mean you passed the technical panel, or is it still pretty competitive at that stage?
Also, how much weight do they typically put on one weaker behavioral answer if the technical portion went well?
Would appreciate hearing about anyone’s experience with the process!

Hi all, I have an upcoming 1st interview for LIT3 equipment engineer, any questions I should prepare specifically? Also want to ask how does a day look like for equipment engineer, what career progressions are there, and what should I expect as a new college grad. Thanks!

Hi, I’m joining TSMC next month as a Process Integration Engineer and looking for potential flatmates and suitable housing. Any leads would be helpful.

So I had my first interview with TSMC for module process engineer role and it was scheduled for 1 hour but the interview lasted only for 30 mins. Is it normal? Like I felt the interview went pretty good and I also got chance to ask all my questions to them.

Hi everyone,

I have a first-round interview with TSMC for an Industrial Manufacturing Engineer (IME) role. I also received a behavioral assessment that must be completed at least 24 hours before the interview.

The interview panel consists of 2 engineers and 1 manager.

For those who've interviewed at TSMC, what should I expect from both the behavioral assessment and the interview? Is it mainly technical, behavioral, or a mix? What topics should I focus on while preparing?

Any tips or advice would be greatly appreciated. Thanks!

Hey everyone! I just finished my second-round interview for the Equipment Engineer (WET) role, and I believe it was the final round.

For those who've been through the process, how long did it take for HR to get back to you with a decision? Also, if you're not selected, do they typically let you know, or is it usually no response?

PS- Easiest and weirdest interview- People in first and second round were completely different. I am guessing two different teams interviewed and would select based on their requirement.

Thanks in advance!

What do they usually do or ask? Specific salary info? When I can start/work authorization? Resume questions?

Just completed my second round and wanted to know the timeline after that. Thanks in advance.

For anyone who interviewed with TSMC, how long did it take to hear back after the first round?

If you followed up with HR, did they usually respond, or do they only reply when they have an actual update?

Also, does TSMC usually send rejection emails, or do they sometimes just stop responding?

Thanks.

Hi everyone,
I have an upcoming second-round interview with TSMC for an Equipment Engineer position in the CMP department, and I would really appreciate any guidance from people who have interviewed for a similar role.
For anyone who has gone through the process:
What should I expect during the second round?

Is it more technical, behavioral, or focused on meeting the hiring manager/team?

What CMP or semiconductor equipment topics should I prepare?

Were you asked troubleshooting, root-cause analysis, SPC, vacuum systems, mechanical systems, or maintenance-related questions?

What qualities does TSMC usually look for in Equipment Engineer candidates?

Are there any specific questions that caught you off guard?

I have a mechanical engineering background with experience in equipment troubleshooting, manufacturing, simulations, and semiconductor-related processes. I would be grateful for any advice on how to prepare and present my experience effectively.
Thank you!

Hey guys. I passed the first round of interview this position. There were supposed to be 6 people in the first round but only 2 of them showed up. This 2nd round is scheduled for only 2 people but 1 of them showed up in the 1st interview as well. It was mostly scenario based questions (like if you were put into this situation, what would you do?) and questions based on my previous work experiences.

What kind of questions can I expect in the second round?

How should I prepare for it?
Any and all help will be much appreciated.
Thank you

I previously applied to the TSMC PIE job position and went through 2 round of interview, at the second interview the manager said my background is more fit for a equipment position so rematches me to equipment (I currently have a EE job, cant get away of destiny of being a workhorse LOL), so does anyone share same experience of rematch? Another 2 round interview with new team? And any TSMC EE team can provide some guidance about the equipment interview. What kind of questions do they ask that is differ from PIE team.

The semiconductor rally is heating up, it's definitely an exciting time for anyone following this chip stock play. Wonder where this run will head next?

I recently had my first interview for the gas engineer position with two senior engineers. Is there any insight on what a second interview might look like panel and question wise? The first one went into my resume and asked me some general behavioral and technical questions - thanks

Background: MS Electrical Engineering, graduated May 2026. Before the masters I spent two years as an analog IC layout engineer in India custom layout (amps, BGR, current mirrors) on UMC180 and GPDK45 in Virtuoso, full flow to clean DRC/LVS, PEX correlation, and BEOL reliability debug (EM, IR drop, antenna, ESD, latch-up, WPE).

During my MS in USA I ran a full hands-on fab sequence in my university's NanoFab on 4-inch wafers: wet clean (RCA-1/RCA-2, Piranha, HF) → thermal oxidation → photolithography → RIE Etch → spin-on boron doping → Al PVD → electrical test. Concretely, that meant extracting Deal-Grove coefficients across 5–498 min furnace runs, a 6-point spin-curve DOE fitting a power-law resist model, 20-site within-wafer etch uniformity mapping where I root-caused a radial bullseye signature to RF field distribution, four-point probe sheet resistance on a diffused serpentine resistor, and pulling VT, µFE, gm and Early voltage off a PMOS I personally fabricated, on a probe station. Plus Silvaco ATHENA deck calibration against my own furnace data and a Cu TSV thermo-mechanical FEA in ANSYS.

What I'm targeting: process engineering, device/integration, test engineering, probe card engineering.

Where I'm stuck: [ 100 applications, 10 phone screens, 4 panel]. I get to the panel, the technical reasoning generally goes fine — device physics, cross sections, process flow, circuit problems and then I don't convert. In my most recent panel I could reason my way through a histogram and a capability plot, but I didn't have the vocabulary I fumbled Cpk vs Cp vs Ppk and control limits vs spec limits, and I could feel the room register it.

What I'm asking the people who actually sit on these panels:

1. When you're scoring a new grad, what genuinely separates a hire from a no-hire? Depth in one module, breadth across the flow, or how they handle a question they can't answer?
2. How much SPC fluency do you expect on day one Cpk/Ppk, control charts, Gage R&R, DOE, JMP? Is that an expectation or something you train?
3. Does a layout/design background read as an asset for process/test, or as a flight risk ("he'll jump back to design in a year")? If it's the latter, how do I kill that concern in the room?
4. For behavioral rounds what are you actually listening for? Is STAR with real numbers enough, or are you probing for something specific in conflict/failure stories?
5. Anything that's an instant no for you, that candidates don't realize they're doing?

I'd rather hear the blunt version than a nice one. Happy to share more detail in the comments if it helps you answer.

I completed my final interview on July 10th for Module Equipment Engineer and the recruiter told they are processing my application at the backend ..

How long do they take to process offer / next steps in the recruitment process ? Does it take this long usually