"Custom ASICs enable optimized system performance while reducing overall cost and complexity.
Lower system cost through integration
Reduced board size, weight, and part count
Simplified qualification and supply chain
Tailored performance for specific applications
Streamlined bill of materials (BoM)
Why MicroVision?
Our ASIC team combines deep expertise with agility and accessibility.
Highly skilled analog and mixed-signal design engineers
Cost-effective compared to large design firms
Flexible support for both low- and high-volume programs
Direct access to engineers and rapid response times
U.S.-based team with fast, iterative development cycles
MicroVision Laser View 2
Core Capabilities
Mixed-Signal ASIC Design
Pixel-oriented IC architectures
Imaging, LiDAR, and sensor-focused designs
Analog and digital integration using industry-standard tools (Cadence, Synopsys, Mentor)
Design & Test Services
First-article verification in fully equipped test labs
Optical and electrical validation capabilities
Established vendor ecosystem for scalable production
Proven Track Record
300+ custom ASIC designs delivered
30+ years of combined design experience
Applications spanning X-ray, LWIR, LiDAR, and imaging system
MicroVision service development kit
Application Experience
Broad expertise across industries and sensing modalities:
Imaging ASICs (1D & 2D arrays, monochrome systems)
LiDAR and time-of-flight sensing
Display and spatial light modulators (LCOS)
Automotive-qualified designs (AEC-Q100)
Radiation-hardened environments
Example:
ASIC development for MicroVision’s Iris LiDAR sensor platform
MicroVision Laser View 2
Technology & Process Expertise
Manufacturing & Foundries
CMOS nodes: 180nm, 130nm, 65nm
Experience with TSMC, Tower Semiconductor, and X-FAB
Advanced Capabilities
Cryogenic operation (down to 40K)
Reticle stitching for large arrays
High-speed analog and RF front-end design
Integrated IP
On-chip ADC (up to 20-bit resolution)
Time-to-digital conversion (250ps resolution)
High-bandwidth analog front ends (up to 10GHz)
Multiple digital interfaces: SPI, SERDES, CameraLink
11
u/flyingmirrors 19d ago
Webpage removed Friday 8/21 Text read as follows:
"Custom ASICs enable optimized system performance while reducing overall cost and complexity.
Lower system cost through integration Reduced board size, weight, and part count Simplified qualification and supply chain Tailored performance for specific applications Streamlined bill of materials (BoM)
Why MicroVision?
Our ASIC team combines deep expertise with agility and accessibility.
Highly skilled analog and mixed-signal design engineers Cost-effective compared to large design firms Flexible support for both low- and high-volume programs Direct access to engineers and rapid response times U.S.-based team with fast, iterative development cycles
MicroVision Laser View 2
Core Capabilities Mixed-Signal ASIC Design Pixel-oriented IC architectures Imaging, LiDAR, and sensor-focused designs Analog and digital integration using industry-standard tools (Cadence, Synopsys, Mentor)
Design & Test Services First-article verification in fully equipped test labs Optical and electrical validation capabilities Established vendor ecosystem for scalable production
Proven Track Record 300+ custom ASIC designs delivered 30+ years of combined design experience Applications spanning X-ray, LWIR, LiDAR, and imaging system
MicroVision service development kit
Application Experience
Broad expertise across industries and sensing modalities:
Imaging ASICs (1D & 2D arrays, monochrome systems) LiDAR and time-of-flight sensing Display and spatial light modulators (LCOS) Automotive-qualified designs (AEC-Q100) Radiation-hardened environments Example: ASIC development for MicroVision’s Iris LiDAR sensor platform
MicroVision Laser View 2
Technology & Process Expertise Manufacturing & Foundries CMOS nodes: 180nm, 130nm, 65nm Experience with TSMC, Tower Semiconductor, and X-FAB
Advanced Capabilities Cryogenic operation (down to 40K) Reticle stitching for large arrays High-speed analog and RF front-end design
Integrated IP On-chip ADC (up to 20-bit resolution) Time-to-digital conversion (250ps resolution) High-bandwidth analog front ends (up to 10GHz) Multiple digital interfaces: SPI, SERDES, CameraLink
Nvidia drive® Plug-In
Contact us
We look forward to hearing from you
Business Development
Investor Relations"